DocumentCode :
1665249
Title :
An optimized driver for SiC JFET-based switches delivering more than 99% efficiency
Author :
Norling, Karl ; Lindholm, Christian ; Draxelmayr, Dieter
Author_Institution :
Infineon Technol., Villach, Austria
fYear :
2012
Firstpage :
284
Lastpage :
286
Abstract :
Nowadays, there is a high demand for highly efficient power converters that can be put in systems such as power factor correctors or solar panels. A silicon carbide (SiC) based power switch has a very good performance when it comes to switching and conduction losses. As on silicon, the manufacturing of junction devices is easier than MOSFET devices because the growth of highly reliable oxide is very challenging [1]. Recently, a family of high-voltage SiC junction FET (JFET) transistors has been developed which has made it possible to reach an efficiency of more than 99% with a buck converter. The low switching loss of these transistors allows for the use of a higher switching frequency and smaller external components which in turn reduce PCB area and overall system cost. A dedicated gate driver with possible bootstrap operation has been developed for a normally-on n-type JFET. It allows maximum efficiency, operation as safe as that of a normally-off switch, and reduced number of external components because of integration of voltage regulator and supervision circuitry. Bootstrapping minimizes the number of supplies needed for the power converter and reduces board space and BOM.
Keywords :
MOSFET; bootstrap circuits; junction gate field effect transistors; power convertors; printed circuits; silicon compounds; BOM; JFET-based switch; MOSFET devices; PCB; SiC; board space reduction; bootstrap operation; high-voltage junction FET transistors; power converters; power factor correctors; solar panels; supervision circuitry; voltage regulator; JFETs; Logic gates; MOSFET circuits; Regulators; Silicon carbide; Switches; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
978-1-4673-0376-7
Type :
conf
DOI :
10.1109/ISSCC.2012.6177003
Filename :
6177003
Link To Document :
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