• DocumentCode
    1665521
  • Title

    Long-term antibacterial effect of nano-skeletoned Cu-TiN films by dual magnetron sputtering

  • Author

    Tian, Xiubo ; Wei, Chunbei ; Gong, Chunzhi ; Yang, Shiqin

  • Author_Institution
    State Key Lab. of Adv. Welding Production & Technol., Harbin Inst. of Technol., Harbin, China
  • fYear
    2010
  • Firstpage
    1380
  • Lastpage
    1381
  • Abstract
    Antibacterial fabrication has increasingly gained more attention. We present the fabrication processes related to nano-layer antibacterial films containing copper in this paper. TiN/Cu-Zn multilayers were deposited on stainless steel by dual magnetron sputtering. The copper content in each layer has to be optimized to form copper clusters. Consequently the TiN may grow on or between the copper clusters and TiN skeleton with copper located inside may be fabricated for long-term antibacterial effect. Influence of modulation period of multilayers on corrosion resistance and antibacterial properties was also investigated. The relationship of corrosion and antibacterial characteristics was also studied. The results show that good corrosion resistance has been achieved in multilayers when Cu-Zn layers are thin and the corrosion resistance increases with increased thickness of TiN layers. However, the corrosion resistance of multilayers decreased dramatically with increasing thickness of Cu-Zn layers. There exists a proper modulation period of nano-multilayer contributing to high antibacterial effect as well as good corrosion resistance.
  • Keywords
    antibacterial activity; biomedical materials; copper; corrosion resistance; multilayers; nanobiotechnology; sputter deposition; titanium compounds; zinc; FeCCrJk; TiN-Cu-Zn; antibacterial effect; copper clusters; corrosion resistance; dual magnetron sputtering; multilayers; nanoskeletoned films; stainless steel; Anti-bacterial; Copper; Corrosion; Fabrication; Magnetic multilayers; Nonhomogeneous media; Skeleton; Sputtering; Steel; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2010 3rd International
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-3543-2
  • Electronic_ISBN
    978-1-4244-3544-9
  • Type

    conf

  • DOI
    10.1109/INEC.2010.5424846
  • Filename
    5424846