• DocumentCode
    1666100
  • Title

    A versatile multi-modality serial link

  • Author

    Tanaka, Yusuke ; Hino, Yasufumi ; Okada, Yasuhiro ; Takeda, Takahiro ; Ohashi, Sho ; Yamagishi, Hiroyuki ; Kawasaki, Kenichi ; Hajimiri, Ali

  • Author_Institution
    Sony, Tokyo, Japan
  • fYear
    2012
  • Firstpage
    332
  • Lastpage
    334
  • Abstract
    Serial data links are often designed targeting a specific transmission medium. High-speed links using different predetermined transmission media have been demonstrated in the past [1-3]. This, however, restricts user´s ability to use an integrated link interface with other transmission media once the chip is fabricated. For example, traditional transceivers for copper interconnects typically transmit baseband data, which is incompatible with a free-space wireless channel that is bandpass in nature and often uses RF carriers. A multi-modality transceiver block compatible with different transmission media is highly desirable as it offers great versatility by allowing the exact same interface circuitry to be used with different transmission media. Such a versatile interface can relax the board and system design requirements and enable the reuse of the same transceiver core with different media, reducing the time and cost overhead of re-designing and re-manufacturing.
  • Keywords
    radio links; radio transceivers; RF carriers; baseband data; copper interconnects; cost overhead; free-space wireless channel; high-speed links; integrated link interface; interface circuitry; multimodality serial link; multimodality transceiver block; predetermined transmission media; serial data links; system design requirements; transceiver core; transmission medium; Bit error rate; Frequency division multiplexing; Impedance; Integrated circuit interconnections; Media; Receivers; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4673-0376-7
  • Type

    conf

  • DOI
    10.1109/ISSCC.2012.6177034
  • Filename
    6177034