DocumentCode
1666487
Title
Mechanical fatigue fracture of silicon - Potential dander to the reliability of silicon MEMS structures
Author
Kamiya, Shoji
Author_Institution
Nagoya Inst. of Technol., Nagoya, Japan
fYear
2010
Firstpage
484
Lastpage
484
Abstract
Silicon and polysilicon are both susceptible to fatigue. It might have been once believed in the beginning of micro electro-mechanical systems (MEMS) technology that silicon is a brittle material with almost unlimited fatigue lifetime. However, recent researches revealed many evidences of fatigue fracture, which is potentially a serious threat for the reliability of MEMS structures Although many MEMS devices are often operated at high frequencies with relatively large stress levels, mechanical fatigue behavior of silicon is one of the most unfamiliar issues in mechanical engineering. While MEMS expands its frontier towards medical and aerospace applications for example, where structural failure leads to immediate danger, knowledge accumulated so far about the fatigue properties of silicon is still quite limited. Even the fundamental mechanism of fatigue is now under intensive debate. Up-to-date information of this hot issue is shared in the presentation, looking for a physical image of fatigue process and statistical evaluation of long term reliability in order to push further forward the possibility of silicon-based microtechnologies.
Keywords
elemental semiconductors; fatigue; micromechanical devices; silicon; statistics; Si; mechanical fatigue fracture; microelectromechanical system technology; silicon MEMS structure reliability; silicon-based microtechnology; statistical evaluation; structural failure; Biomedical imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro-NanoMechatronics and Human Science (MHS), 2010 International Symposium on
Conference_Location
Nagoya
Print_ISBN
978-1-4244-7995-5
Type
conf
DOI
10.1109/MHS.2010.5669498
Filename
5669498
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