DocumentCode
1666875
Title
Dielectrophoretic addressable deposition of arc-SWCNTs for high-throughput screening FET arrays
Author
Guo, Wei ; Dou, Zengpei ; Tian, Xiaoxue ; Sun, Hongfang ; Huang, Yanyi ; Xu, Dongsheng ; Liu, Yuanfang
Author_Institution
Dept. Chem. Biol., Peking Univ., Beijing, China
fYear
2010
Firstpage
490
Lastpage
491
Abstract
For fabrication of arc-discharged single walled carbon nanotubes (arc-SWCNTs) based FET array, controllable deposition of SWNTs is an important issue. In this study highly purified arc-SWCNTs are deposited on the high-throughput screening FET array via the addressable dielectrophoresis method. The electrodes array are designed with different electrode gaps, from 3 to 20 ¿m, every electrode has its own address. In order to limit the SWCNTs to be deposited within the electrodes area, we designed a deposition window on the silicon chip surface by the optical lithography. Then the diluted SWCNTs solution was dropped onto the limited window. By setting a voltage (10 V, 100 kHz) between a specific source electrode and the shared drain electrode, the SWCNTs can be aligned evenly within the pair of electrodes via the dielectrophoresis process. This method might facilitate the controllable fabrication of high throughput screening SWCNTs-FET arrays for biosensors.
Keywords
arcs (electric); carbon nanotubes; electrochemical electrodes; electrophoresis; field effect transistors; nanofabrication; photolithography; C; SWCNT-FET arrays; arc-SWCNT; arc-discharged single walled carbon nanotubes; biosensors; deposition window; dielectrophoretic addressable deposition; diluted SWCNT solution; drain electrode; electrode array; frequency 100 kHz; high-throughput screening FET array; optical lithography; silicon chip surface; size 3 mum to 20 mum; specific source electrode; voltage 10 V; Biomedical optical imaging; Carbon nanotubes; Dielectrophoresis; Electrodes; FETs; Fabrication; Lithography; Optical design; Silicon; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-3543-2
Electronic_ISBN
978-1-4244-3544-9
Type
conf
DOI
10.1109/INEC.2010.5424895
Filename
5424895
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