DocumentCode :
1666999
Title :
Mechanical and electrical properties of Cu-Ag nanocomposites processed by equal channel angular pressing (ECAP)
Author :
Cho, Kyu-Jin ; Hong, Sun Ig
Author_Institution :
Dept. of Adv. Mater. Eng., Chungnam Nat. Univ., Daejeon, South Korea
fYear :
2010
Firstpage :
1291
Lastpage :
1292
Abstract :
Equal channel angular pressing was carried out on Cu-Ag composites at room temperature. ECAPed Cu-Ag exhibited ultrafine structure with the shape and distribution of Ag phase dependent on the processing routes. In route A, the initial lamellae of Ag phase were elongated along the shear direction and developed into filaments whereas the initial lamellae became finer by fragmentation with no pronounced change of the shape in route Bc. The hardness of ECAPed Cu-Ag is greater than that of ECAPed Cu. The higher hardness in Cu-Ag is ascribed to the more effective matrix strengthening due to the dislocation storage at the interface and the precipitation hardening. The hardness of ECAPed Cu-Ag was lower than the drawn Cu-Ag at the same deformation strain because of the less effective refinement and elongation of the two-phase filamentary microstructure. The application of ECAP in Cu-Ag was found to be effective in the modification of structure, shape and distribution of phases in composite and the increase of the strength.
Keywords :
copper; deformation; dislocations; elongation; hardness; nanocomposites; precipitation hardening; pressing; silver; Cu-Ag; deformation strain; dislocation storage; effective matrix strengthening; effective refinement; elongation; equal channel angular pressing; fragmentation; hardness; lamellae phase; nanocomposites; phase distribution; phase shape; precipitation hardening; shear direction; structure modification; temperature 293 K to 298 K; two-phase filamentary microstructure; ultrafine structure; Capacitive sensors; Conductivity; Copper; Mechanical factors; Microstructure; Nanocomposites; Optical microscopy; Pressing; Scanning electron microscopy; Transmission electron microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-3543-2
Electronic_ISBN :
978-1-4244-3544-9
Type :
conf
DOI :
10.1109/INEC.2010.5424899
Filename :
5424899
Link To Document :
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