Submicronics technology: the services available from CMP

This paper is about the CMP service (Circuits Multi-Projects). CMP aims at providing universities, research laboratories and industries with the possibility to have their integrated circuits projects fabricated. The service has started in 1981. Presently customers are serviced for a CMOS double layer metal technology (DLM) 0.7 μ, a CMOS double layer polysilicon/double layer metal (DLP/DLM) 1.2 μ, 0.8 μ and 0.6 μ, a BiCMOS DLP/DLM 1.2 μ and 0.8 μ a digital GaAs 0.6 μ, and a HEMT GaAs 0.2 μ. Recently the 0.25 μ CMOS process from SGS-Thomson has been added to the portfolio. Micro electro mechanical systems (MEMS) are also provided through standard CMP runs in CMOS DLP/DLM 1.2 μ, BiCMOS DLP/DLM 1.2 μ and HEMT GaAs 0.2 μ, using compatible front-side bulk micromachining. Finally, the main processes for multi chip modules (MCMs) are also accessible through CMP. There are about 40 runs per year. The paper details the service, including some basic principles, some history, the descriptive formats, etc