Title :
Custom test chip for system-level ESD investigations
Author :
Thomson, Nicholas ; Yang Xiu ; Mertens, Robert ; Keel, Min-Sun ; Rosenbaum, Elyse
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Abstract :
A test-chip for monitoring soft failures is presented. Diagnostics include logic circuit upset detection, substrate potential latchup monitors, input glitch detectors, system IDDQ monitors, and USB transmitters. Powered TLP testing and IEC61000-4-2 ESD produce different failures. Also, different failures are reported for mobile systems and those powered through grounded supplies.
Keywords :
IEC standards; electrostatic discharge; integrated circuit reliability; integrated circuit testing; radiation hardening (electronics); IEC 61000-4-2; TLP testing; USB transmitter; custom test chip; input glitch detector; logic circuit upset detection; soft failure monitoring; substrate potential latchup monitor; system IDDQ monitor; system-level ESD investigations; Detectors; Electrostatic discharges; Integrated circuits; Latches; Logic gates; Monitoring; Pins;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2014 36th
Conference_Location :
Tucson, AZ
