Title :
Overcoming multi finger turn-on in HV DIACs using local poly-ballasting
Author :
Aliaj, B. ; Vashchenko, V.A. ; Liou, Juin J. ; Mitchell, Tom
Author_Institution :
Maxim Integrated Products, San Jose, CA, USA
Abstract :
Miscorrelation between TLP, IEC contact and IEC air-gap high current capability of dual-direction DIAC devices is experimentally observed and explained by non-simultaneous turn on the DIAC device fingers. The effect is studied using numerical simulation, followed by the experimental validation of the new proposed design with poly-emitter ballasting.
Keywords :
air gaps; electrostatic discharge; semiconductor diodes; DIAC device fingers; HV DIACs; IEC air-gap high current capability; IEC contact; TLP; dual-direction DIAC devices; local poly-ballasting; multifinger turn-on; numerical simulation; poly-emitter ballasting; system level ESD protection; Electronic ballasts; Electrostatic discharges; Fingers; Hidden Markov models; IEC; Resistors; Thyristors;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2014 36th
Conference_Location :
Tucson, AZ
