Title :
Field collapse event ESD test method
Author :
Tamminen, Pasi ; Viheriakoski, Toni ; Reinvuo, Tuomas ; Sydanheimo, Lauri ; Ukkonen, Leena
Author_Institution :
Tampere Univ. of Technol., Tampere, Finland
Abstract :
A novel field collapse event ESD test method is presented in this paper. The device under test is continuously grounded in an electrostatic field and when the field is removed it drives current through the device. We show with measurements and simulations how to use this method to test ESD immunity of electronic products.
Keywords :
electric fields; electronic products; electrostatic discharge; electronic products; electrostatic field; field collapse event ESD test method; Capacitance; Current measurement; Discharges (electric); Electrostatic discharges; Fault diagnosis; Integrated circuit modeling; Wires;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2014 36th
Conference_Location :
Tucson, AZ
