• DocumentCode
    166750
  • Title

    Field collapse event ESD test method

  • Author

    Tamminen, Pasi ; Viheriakoski, Toni ; Reinvuo, Tuomas ; Sydanheimo, Lauri ; Ukkonen, Leena

  • Author_Institution
    Tampere Univ. of Technol., Tampere, Finland
  • fYear
    2014
  • fDate
    7-12 Sept. 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A novel field collapse event ESD test method is presented in this paper. The device under test is continuously grounded in an electrostatic field and when the field is removed it drives current through the device. We show with measurements and simulations how to use this method to test ESD immunity of electronic products.
  • Keywords
    electric fields; electronic products; electrostatic discharge; electronic products; electrostatic field; field collapse event ESD test method; Capacitance; Current measurement; Discharges (electric); Electrostatic discharges; Fault diagnosis; Integrated circuit modeling; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2014 36th
  • Conference_Location
    Tucson, AZ
  • ISSN
    0739-5159
  • Type

    conf

  • Filename
    6968810
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=166750