Title :
A 1V 357Mb/s-throughput transferjet™ SoC with embedded transceiver and digital baseband in 90nm CMOS
Author :
Tamura, Masahisa ; Kondo, Fumitaka ; Watanabe, Katsumi ; Aoki, Yasunori ; Shinohe, Yusuke ; Uchino, Koki ; Hashimoto, Yuhei ; Nishiyama, Fumihiro ; Miyachi, Hiroaki ; Nagase, Ikuho ; Uezono, Itaru ; Hisamura, Rie ; Maekawa, Itaru
Author_Institution :
Sony, Tokyo, Japan
Abstract :
TransferJet™, based on DSSS-UWB, is a promising standard protocol which provides users high-speed, short-range, simple-usage, low-power and robust connectivity. Since its communication distance is limited to a few centimeters, the required TX output power is small enough to meet regulatory restrictions in many countries. This paper presents the first SoC that implements PHY and Connection Layer (CNL) functionality from the TransferJet™ and ECMA-398 standards. All the RF building blocks as well as digital baseband are integrated including PHY, CNL and SDIO 3.0 device controller. A coupler and an RF BPF are the only external components required to complete a wireless system.
Keywords :
CMOS integrated circuits; protocols; radio transceivers; radiofrequency integrated circuits; spread spectrum communication; system-on-chip; ultra wideband communication; DSSS-UWB; ECMA-398 standards; PHY layer; RF building blocks; SDIO 3.0 device controller; bit rate 357 Mbit/s; communication distance; connection layer; digital baseband; embedded transceiver; size 90 nm; standard protocol; throughput Transferjet SoC; voltage 1 V; wireless system; CMOS integrated circuits; Clocks; Phase locked loops; Phase noise; Radio frequency; System-on-a-chip; Voltage control;
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4673-0376-7
DOI :
10.1109/ISSCC.2012.6177081
