Title :
A general-purpose link interface chipset for gigabit rate data communication
Author :
Yen, C. ; Walker, R. ; Stout, C. ; Lai, B. ; Win, J.
Author_Institution :
Hewlett Packard Co., Palo Alto, CA, USA
Abstract :
A chipset has been developed for transmitting parallel data over serial links. The chipset, consisting of a transmitter interface chip (TIC) and a receiver interface chip (RIC), can support serial transmission up to 1.4 Gbaud. Data encoding is based on a scheme published earlier, but has been improved to provide more flexibility and better efficiency. The chipset requires no external components for its operation other than a few capacitors, which are built into its custom package
Keywords :
application specific integrated circuits; bipolar integrated circuits; integrated optoelectronics; optical communication equipment; optical receivers; Si bipolar process; custom package; encoding; general-purpose link interface chipset; gigabit rate data communication; optical links; receiver interface chip; transmitter interface chip; Capacitors; Clocks; Coaxial cables; Data communication; Encoding; Optical fiber communication; Optical receivers; Optical transmitters; Packaging; Synchronization;
Conference_Titel :
Global Telecommunications Conference, 1992. Conference Record., GLOBECOM '92. Communication for Global Users., IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0608-2
DOI :
10.1109/GLOCOM.1992.276493
