DocumentCode
1667595
Title
A general-purpose link interface chipset for gigabit rate data communication
Author
Yen, C. ; Walker, R. ; Stout, C. ; Lai, B. ; Win, J.
Author_Institution
Hewlett Packard Co., Palo Alto, CA, USA
fYear
1992
Firstpage
197
Abstract
A chipset has been developed for transmitting parallel data over serial links. The chipset, consisting of a transmitter interface chip (TIC) and a receiver interface chip (RIC), can support serial transmission up to 1.4 Gbaud. Data encoding is based on a scheme published earlier, but has been improved to provide more flexibility and better efficiency. The chipset requires no external components for its operation other than a few capacitors, which are built into its custom package
Keywords
application specific integrated circuits; bipolar integrated circuits; integrated optoelectronics; optical communication equipment; optical receivers; Si bipolar process; custom package; encoding; general-purpose link interface chipset; gigabit rate data communication; optical links; receiver interface chip; transmitter interface chip; Capacitors; Clocks; Coaxial cables; Data communication; Encoding; Optical fiber communication; Optical receivers; Optical transmitters; Packaging; Synchronization;
fLanguage
English
Publisher
ieee
Conference_Titel
Global Telecommunications Conference, 1992. Conference Record., GLOBECOM '92. Communication for Global Users., IEEE
Conference_Location
Orlando, FL
Print_ISBN
0-7803-0608-2
Type
conf
DOI
10.1109/GLOCOM.1992.276493
Filename
276493
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