DocumentCode :
166765
Title :
Automated latchup analysis
Author :
Vashchenko, V.A. ; Shibkov, A.A.
fYear :
2014
fDate :
7-12 Sept. 2014
Firstpage :
1
Lastpage :
8
Abstract :
A new simulation approach to the analysis of the low voltage latchup in CMOS process and the high voltage latchup in BCD process technologies is presented. The approach uses new automated numerical algorithm simulating real standard three-stage latchup test and relies on parameterized 2-D mixed-mode simulation of a finite-element model (FEM) structure that represents the parasitic structure formed in the physical IC layout.
Keywords :
BIMOS integrated circuits; CMOS integrated circuits; electronic design automation; integrated circuit layout; 2D mixed-mode simulation; BCD process; CMOS process; automated latchup analysis; automated numerical algorithm; finite element model; high voltage latchup; low voltage latchup; physical IC layout; CMOS process; Integrated circuit modeling; Layout; Power supplies; Semiconductor device modeling; Thyristors; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2014 36th
Conference_Location :
Tucson, AZ
ISSN :
0739-5159
Type :
conf
Filename :
6968818
Link To Document :
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