• DocumentCode
    1668000
  • Title

    New microwave dielectric material for application in mobile communication

  • Author

    Chen, Yih-Chien ; Hsu, Wei-Yu ; Chen, Kuei-Chien ; Lin, Jing-Yuan

  • Author_Institution
    Dept. of Electr. Eng., Lunghua Univ. of Sci. & Technol., Taoyuan, Taiwan
  • fYear
    2010
  • Firstpage
    1224
  • Lastpage
    1225
  • Abstract
    In this study, the microwave dielectric properties of La2.98/3Ba0.01(Mg0.5Sn0.5)O3 ceramics prepared by the conventional solid-state method have been investigated for application in mobile communication. B2O3 was selected as a liquid sintering aid to lower the sintering temperature of La2.98/3Ba0.01(Mg0.5Sn0.5)O3 ceramics. It was found that the X-ray diffraction patterns of the La2.98/3Ba0.01(Mg0.5Sn0.5)O3 ceramics exhibited no significant phase difference with 0.25 wt% B2O3 additive at different sintering temperatures from 1350 to 1550 °C. The maximum values of the dielectric constant and the quality factor multiples resonant frequency (Q×f) can be obtained when the La2.98/3Ba0.01(Mg0.5Sn0.5)O3 with 0.25 wt% B2O3 additive were sintered at 1400 °C for 4h. The temperature coefficient of resonant frequency ¿f (-72 ppm/ °C) was measured for La2.98/3Ba0.01(Mg0.5Sn0.5)O3 ceramics with 0.25 wt% B2O3 sintered at 1400 °C for 4 h.
  • Keywords
    X-ray diffraction; barium compounds; dielectric materials; lanthanum compounds; magnesium compounds; microwave materials; mobile communication; sintering; tin compounds; LaBa(MgSn)O; X-ray diffraction patterns; liquid sintering aid; microwave dielectric material; mobile communication; sintering temperatures; solid-state method; temperature 1350 C to 1550 C; Additives; Ceramics; Dielectric materials; Microwave theory and techniques; Mobile communication; Resonant frequency; Solid state circuits; Temperature; Tin; X-ray diffraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2010 3rd International
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-3543-2
  • Electronic_ISBN
    978-1-4244-3544-9
  • Type

    conf

  • DOI
    10.1109/INEC.2010.5424942
  • Filename
    5424942