Title :
Magnetic properties and microstructure of Fe/FePt films with perpendicular magnetization
Author :
Tsai, Jai-Lin ; Tzeng, Hsin-Te ; Liu, Bing-Fong
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Chung Hsing Univ., Taichung, Taiwan
Abstract :
The soft/hard Fe/FePt bilayer with perpendicular magnetization has been prepared successfully on glass substrate. The (001) oriented L10 FePt film with fix thickness 10 nm was deposited on glass and subsequently annealing by rapid thermal process (RTP) at 800°C for 5 minutes and a Fe layer was deposited at room temperature with thickness of 2 nm to 10 nm. The control of Fe layer thickness allowed modifying the hysteresis loops from rigid magnet to exchange-spring magnet due to the nanoscale soft/hard interface coupling. When the Fe layer thickness increased to 3 nm, the out-of-plane coercivity is reduced to 5.88 kOe but the remanence ratio (0.98) is high. The Fe (3 nm)/FePt bilayer shows perpendicular magnetization with linear in-plane hysteresis loop. The remanence ratio is reduced to 0.86 when the Fe layer thickness increased up to 6 nm. When the Fe layer increased up to 10 nm, the hysteresis loop shows exchange spring-like behavior. The out-of-plane coercivity is still 4 kOe but the remanence ratio is 0.19. The films with perpendicular coercivity were moderated successfully by the soft magnetic layer with different thickness.
Keywords :
coercive force; crystal microstructure; iron; iron alloys; magnetic hysteresis; magnetic thin films; nanostructured materials; platinum alloys; rapid thermal annealing; remanence; (001) oriented L10 FePt film; Fe-FePt; annealing; exchange spring-like property; exchange-spring magnet; glass substrate; iron layer; linear in-plane hysteresis loop; microstructure; nanoscale soft-hard interface coupling; out-of-plane coercivity; perpendicular coercivity; perpendicular magnetization; rapid thermal process; remanence; size 2 nm to 10 nm; soft-hard bilayer; temperature 293 K to 1073 K; thin films; time 5 min; Coercive force; Glass; Iron; Magnetic films; Magnetic hysteresis; Magnetic properties; Magnetization; Microstructure; Remanence; Soft magnetic materials;
Conference_Titel :
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-3543-2
Electronic_ISBN :
978-1-4244-3544-9
DOI :
10.1109/INEC.2010.5424945