Thin copper metal interconnections thermomigration analysis in ESD regime

Author

Di Biccari, Leonardo ; Cerati, Lorenzo ; Pozzobon, Fiorella ; Zullino, Lucia ; Morin, Sonia ; Pizzo, G. ; Boroni, Andrea ; Andreini, Antonio

Author_Institution

STMicroelectron., Agrate Brianza, Italy

fYear

2014

fDate

7-12 Sept. 2014

Firstpage

1

Lastpage

10

Abstract

The technological scaling is posing severe constraints on metal interconnections design, especially for ESD protection network routing in advanced Smart-power technologies. A detailed analysis of thin interconnections failure mechanisms under high power pulses and of the related root causes is mandatory. In this paper this analysis is illustrated by use of characterizations, failure analyses and 3D TCAD physical simulations data.

Keywords

copper alloys; electrostatic discharge; failure analysis; integrated circuit interconnections; 3D TCAD physical simulation data; Cu; ESD protection network routing; ESD regime; advanced smart-power technology; failure analyses; high power pulses; interconnections failure mechanisms; metal interconnection design; technological scaling; thermomigration analysis; thin copper metal interconnections; Copper; Degradation; Electrostatic discharges; Failure analysis; Stress; Strips;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2014 36th

Conference_Location

Tucson, AZ

ISSN

0739-5159

Type

conf

Filename

6968842