Title :
Thin copper metal interconnections thermomigration analysis in ESD regime
Author :
Di Biccari, Leonardo ; Cerati, Lorenzo ; Pozzobon, Fiorella ; Zullino, Lucia ; Morin, Sonia ; Pizzo, G. ; Boroni, Andrea ; Andreini, Antonio
Author_Institution :
STMicroelectron., Agrate Brianza, Italy
Abstract :
The technological scaling is posing severe constraints on metal interconnections design, especially for ESD protection network routing in advanced Smart-power technologies. A detailed analysis of thin interconnections failure mechanisms under high power pulses and of the related root causes is mandatory. In this paper this analysis is illustrated by use of characterizations, failure analyses and 3D TCAD physical simulations data.
Keywords :
copper alloys; electrostatic discharge; failure analysis; integrated circuit interconnections; 3D TCAD physical simulation data; Cu; ESD protection network routing; ESD regime; advanced smart-power technology; failure analyses; high power pulses; interconnections failure mechanisms; metal interconnection design; technological scaling; thermomigration analysis; thin copper metal interconnections; Copper; Degradation; Electrostatic discharges; Failure analysis; Stress; Strips;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD), 2014 36th
Conference_Location :
Tucson, AZ
