• DocumentCode
    1668241
  • Title

    Integration and innovation in the nanoelectronics era

  • Author

    Chou, Sunlin

  • Author_Institution
    Technol. & Manuf. Group, Intel Corp., Hillsboro, OR, USA
  • fYear
    2005
  • Firstpage
    36
  • Abstract
    Demand for electronics continues to grow as new products combine and enhance computing, communications, and digital capabilities. Hardware and software are evolving to enable new applications and usage modes, by offering features such as multitasking, parallel processing, mobility and wireless connectivity. Integration at both component and product platform levels, and efficient use of power, will become more important. These call for holistic solutions involving systems, circuits, processes, devices, and packaging. Many techniques to improve power efficiency have been developed and more will emerge. Silicon technology and scaling remain keys to progress, with transistors and circuit elements already at nanoscale dimensions. Innovation will accelerate as nanotechnology further renews and extends silicon technology. Skillful integration of new materials, processes, and device structures will be essential. Successful nanoelectronics companies will excel in innovation and integration, extend Moore´s law into and beyond the next decade, and drive the development of future growth opportunities.
  • Keywords
    electronics industry; integrated circuits; monolithic integrated circuits; nanoelectronics; semiconductor technology; silicon; technological forecasting; Moore law; communications; computing; digital capabilities; innovation; integration; mobility; multitasking; nanoelectronics era; nanotechnology; parallel processing; power efficiency; scaling; silicon technology; wireless connectivity; Acceleration; Application software; Circuits; Hardware; Multitasking; Nanoelectronics; Packaging; Parallel processing; Silicon; Technological innovation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2005. Digest of Technical Papers. ISSCC. 2005 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    0-7803-8904-2
  • Type

    conf

  • DOI
    10.1109/ISSCC.2005.1493858
  • Filename
    1493858