DocumentCode :
1668241
Title :
Integration and innovation in the nanoelectronics era
Author :
Chou, Sunlin
Author_Institution :
Technol. & Manuf. Group, Intel Corp., Hillsboro, OR, USA
fYear :
2005
Firstpage :
36
Abstract :
Demand for electronics continues to grow as new products combine and enhance computing, communications, and digital capabilities. Hardware and software are evolving to enable new applications and usage modes, by offering features such as multitasking, parallel processing, mobility and wireless connectivity. Integration at both component and product platform levels, and efficient use of power, will become more important. These call for holistic solutions involving systems, circuits, processes, devices, and packaging. Many techniques to improve power efficiency have been developed and more will emerge. Silicon technology and scaling remain keys to progress, with transistors and circuit elements already at nanoscale dimensions. Innovation will accelerate as nanotechnology further renews and extends silicon technology. Skillful integration of new materials, processes, and device structures will be essential. Successful nanoelectronics companies will excel in innovation and integration, extend Moore´s law into and beyond the next decade, and drive the development of future growth opportunities.
Keywords :
electronics industry; integrated circuits; monolithic integrated circuits; nanoelectronics; semiconductor technology; silicon; technological forecasting; Moore law; communications; computing; digital capabilities; innovation; integration; mobility; multitasking; nanoelectronics era; nanotechnology; parallel processing; power efficiency; scaling; silicon technology; wireless connectivity; Acceleration; Application software; Circuits; Hardware; Multitasking; Nanoelectronics; Packaging; Parallel processing; Silicon; Technological innovation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 2005. Digest of Technical Papers. ISSCC. 2005 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
0-7803-8904-2
Type :
conf
DOI :
10.1109/ISSCC.2005.1493858
Filename :
1493858
Link To Document :
بازگشت