DocumentCode
1668241
Title
Integration and innovation in the nanoelectronics era
Author
Chou, Sunlin
Author_Institution
Technol. & Manuf. Group, Intel Corp., Hillsboro, OR, USA
fYear
2005
Firstpage
36
Abstract
Demand for electronics continues to grow as new products combine and enhance computing, communications, and digital capabilities. Hardware and software are evolving to enable new applications and usage modes, by offering features such as multitasking, parallel processing, mobility and wireless connectivity. Integration at both component and product platform levels, and efficient use of power, will become more important. These call for holistic solutions involving systems, circuits, processes, devices, and packaging. Many techniques to improve power efficiency have been developed and more will emerge. Silicon technology and scaling remain keys to progress, with transistors and circuit elements already at nanoscale dimensions. Innovation will accelerate as nanotechnology further renews and extends silicon technology. Skillful integration of new materials, processes, and device structures will be essential. Successful nanoelectronics companies will excel in innovation and integration, extend Moore´s law into and beyond the next decade, and drive the development of future growth opportunities.
Keywords
electronics industry; integrated circuits; monolithic integrated circuits; nanoelectronics; semiconductor technology; silicon; technological forecasting; Moore law; communications; computing; digital capabilities; innovation; integration; mobility; multitasking; nanoelectronics era; nanotechnology; parallel processing; power efficiency; scaling; silicon technology; wireless connectivity; Acceleration; Application software; Circuits; Hardware; Multitasking; Nanoelectronics; Packaging; Parallel processing; Silicon; Technological innovation;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2005. Digest of Technical Papers. ISSCC. 2005 IEEE International
Conference_Location
San Francisco, CA
ISSN
0193-6530
Print_ISBN
0-7803-8904-2
Type
conf
DOI
10.1109/ISSCC.2005.1493858
Filename
1493858
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