DocumentCode
1668383
Title
f/sub T/ variation caused by channel width effects in ladder gate structure for RF SOI MOSFETs
Author
Hyeokjae Lee ; Jono-Ho Lee ; Young June Park ; Hong Shick Min
Author_Institution
Sch. of EECS, Seoul Nat. Univ., South Korea
fYear
2001
Firstpage
27
Lastpage
28
Abstract
The scaling down of CMOS-SOI technologies have challenged the deep-submicron minimum feature size. This-promises great expectations for CMOS RF applications. The gate length along with the relative wide gate width in RF circuits leads to reconsideration of gate design. We present f/sub T/ and f/sub max/ properties associated with layout and body resistance of the ladder structure in PD-SOI devices and the resulting speed characteristics (strong function of the number of fingers and gate shape types such as T-gate and H-gate) is evaluated by g/sub m/ variation (/spl Delta/g/sub m/) and extra parasitic capacitance (/spl Delta/C/sub gs/).
Keywords
MOSFET; capacitance; semiconductor device measurement; semiconductor device models; silicon-on-insulator; CMOS-SOI technologies; H-gate; PD-SOI devices; RF SOI MOSFETs; Si; T-gate; body resistance; channel width effects; cut off frequency; deep-submicron minimum feature size; extra parasitic capacitance; f/sub T/ variation; gate design; gate length; gate width; ladder gate structure; layout; speed characteristics; Board of Directors; CMOS technology; Circuits; Fingers; Immune system; MOSFETs; Parasitic capacitance; Radio frequency; Shape; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 2001 IEEE International
Conference_Location
Durango, CO, USA
ISSN
1078-621X
Print_ISBN
0-7803-6739-1
Type
conf
DOI
10.1109/SOIC.2001.957968
Filename
957968
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