• DocumentCode
    1668579
  • Title

    New implant equipment for the production of commercial SOI substrates

  • Author

    White, N.R. ; Sieradzki, M. ; Bell, E.W.

  • Author_Institution
    Diamond Semicond. Group LLC, Gloucester, MA, USA
  • fYear
    2001
  • Firstpage
    41
  • Lastpage
    42
  • Abstract
    For SIMOX or Smartcut/sup TM/ wafers to become commercially viable for mass production. the cost of implantation needs to be reduced. The cost per implant is closely linked to the ratio of the throughput to the cost of the equipment. Technologists in the field have been working at reducing the dose requirements. but given the existence of viable processes. what has been done, or could be done, to minimize the cost of performing the process? In this paper we discuss the optimization of the equipment around the process, as the industry moves from the pilot phase into full production. New simplifications in the design of implanters are presented which could provide significant reductions in the cost of processing wafers of either type.
  • Keywords
    SIMOX; accelerator control systems; batch processing (industrial); closed loop systems; integrated circuit manufacture; ion sources; process control; proton sources; temperature control; DC parallel nonuniform beam; SIMOX wafers; Si-SiO/sub 2/; Smartcut wafers; accurate dose control; batch approach; closed-loop control; commercial SOI substrates; cost per implant; cost-of-ownership savings; dedicated implanter; dedicated proton source; dose requirement; implant equipment; mass production; multipole designs; optimization; ribbon hydrogen beams; two-magnet system; uniform temperature control; Costs; Current density; Implants; Magnetic materials; Magnetic separation; Mass production; Optimized production technology; Substrates; Temperature control; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2001 IEEE International
  • Conference_Location
    Durango, CO, USA
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-6739-1
  • Type

    conf

  • DOI
    10.1109/SOIC.2001.957975
  • Filename
    957975