DocumentCode
1668579
Title
New implant equipment for the production of commercial SOI substrates
Author
White, N.R. ; Sieradzki, M. ; Bell, E.W.
Author_Institution
Diamond Semicond. Group LLC, Gloucester, MA, USA
fYear
2001
Firstpage
41
Lastpage
42
Abstract
For SIMOX or Smartcut/sup TM/ wafers to become commercially viable for mass production. the cost of implantation needs to be reduced. The cost per implant is closely linked to the ratio of the throughput to the cost of the equipment. Technologists in the field have been working at reducing the dose requirements. but given the existence of viable processes. what has been done, or could be done, to minimize the cost of performing the process? In this paper we discuss the optimization of the equipment around the process, as the industry moves from the pilot phase into full production. New simplifications in the design of implanters are presented which could provide significant reductions in the cost of processing wafers of either type.
Keywords
SIMOX; accelerator control systems; batch processing (industrial); closed loop systems; integrated circuit manufacture; ion sources; process control; proton sources; temperature control; DC parallel nonuniform beam; SIMOX wafers; Si-SiO/sub 2/; Smartcut wafers; accurate dose control; batch approach; closed-loop control; commercial SOI substrates; cost per implant; cost-of-ownership savings; dedicated implanter; dedicated proton source; dose requirement; implant equipment; mass production; multipole designs; optimization; ribbon hydrogen beams; two-magnet system; uniform temperature control; Costs; Current density; Implants; Magnetic materials; Magnetic separation; Mass production; Optimized production technology; Substrates; Temperature control; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 2001 IEEE International
Conference_Location
Durango, CO, USA
ISSN
1078-621X
Print_ISBN
0-7803-6739-1
Type
conf
DOI
10.1109/SOIC.2001.957975
Filename
957975
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