DocumentCode :
1669098
Title :
Growth and characterization of Ni3FeN thin films by reactive gas timing RF magnetron sputtering
Author :
Techitdheera, Wicharn ; Thassana, Chewa ; Pecharapa, Wisanu ; Nukaew, Jiti
Author_Institution :
Dept. of Appl. Phys., King Mongkut´´s Inst. of Technol. Ladkrabang, Bangkok, Thailand
fYear :
2010
Firstpage :
1151
Lastpage :
1152
Abstract :
Ni3FeN films were deposited on the glass substrate at room temperature by reactive gas timing rf magnetron sputtering, with two conditions: (1) a time period of Ar:N2 gas (2) a flow rate of Ar:N2 gas. Our results show that sputter rate increase with increasing of a time period and the rate of Ar:N2 gas. The crystal structure of thin films was investigated by X-ray diffraction show fcc structure of Ni3FeN (200) plane. The lattice constants increase with increasing of the flow rate of the nitrogen gas but it decrease with increasing of a time period of Ar gas. The grain size of thin films were investigated by atomic force microscope show the size range between 20-120 nm.
Keywords :
X-ray diffraction; atomic force microscopy; crystal structure; glass; grain size; iron compounds; lattice constants; nickel compounds; sputter deposition; substrates; thin films; Ar-N2; Ni3FeN; RF magnetron sputtering; X-ray diffraction; atomic force microscope; crystal structure; flow rate; glass substrate; grain size; lattice constants; reactive gas timing; size 20 nm to 120 nm; temperature 293 K to 298 K; thin films; Argon; Atomic force microscopy; Glass; Grain size; Lattices; Nitrogen; Sputtering; Temperature; Timing; X-ray diffraction;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-3543-2
Electronic_ISBN :
978-1-4244-3544-9
Type :
conf
DOI :
10.1109/INEC.2010.5424982
Filename :
5424982
Link To Document :
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