Title :
Mechanical stresses and the reliability of microsystems
Author :
Michel, B. ; Winkler, T. ; Auersperg, J. ; Reichl, H.
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
Abstract :
The reliability of microelectronic components and systems containing chips depends strongly on the reliability of electronic packages. Packaging of microsystems has become an important field of research activities in the last years. Many new packaging technologies ranging from Chip-on-Board (COB), Flip Chip (FP) or Chip Size Packaging (CSP) to hybrid packaging have emerged. Various kinds of inhomogeneities, localized internal stresses and the phenomena related to the so-called “thermal misfit” have to be taken into account. Crack and fracture phenomena in microsystems have to be considered, too
Keywords :
ball grid arrays; chip scale packaging; failure analysis; finite element analysis; flip-chip devices; fracture mechanics; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; internal stresses; soldering; thermal stress cracking; BGA; COB; chip size packaging; crack phenomena; electronic package reliability; failure analysis; flip chip packages; fracture phenomena; hybrid packaging; local damage model; local deformation; localized internal stresses; mechanical stresses; microelectronic components; microsystems; nonlinear FEM; reliability; solder joints; thermal fatigue; thermal misfit; Assembly; Chip scale packaging; Electronic packaging thermal management; Electronics packaging; Fatigue; Finite element methods; Internal stresses; Microelectronics; Surface-mount technology; Thermal stresses;
Conference_Titel :
Electrotechnical Conference, 1998. MELECON 98., 9th Mediterranean
Conference_Location :
Tel-Aviv
Print_ISBN :
0-7803-3879-0
DOI :
10.1109/MELCON.1998.692399
