DocumentCode
1669243
Title
Double-gate SOI MOSFET fabrication from bulk silicon wafer
Author
Xinnan Lin ; Chuguang Feng ; Shengdong Zhang ; Wai-Hung Ho ; Mansun Chan
Author_Institution
Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
fYear
2001
Firstpage
93
Lastpage
94
Abstract
The double-gate SOI structure is believed to be the most scalable technology down to the 0.02/spl mu/m regime. However, experimental study of double-gate related phenomena has been hindered by the difficulties in fabricating double-gate devices. In this paper, a simple and yet flexible method to fabricate an experimental double-gate device is proposed. The double-gate device is actually fabricated on a silicon film recrystallized from amorphous silicon (referred as large grain polysilicon-on-insulator or LPSOI film), which is not truly single crystal SOI. However, material and device characteristics show that the film is equivalent to single crystal SOI film with high defect density, like SOI wafers produced in the early days. Thus, all physical properties of double gate SOI devices are preserved.
Keywords
MOSFET; oxidation; silicon-on-insulator; 0.02 micron; LOCOS; LPSOI film; Si; amorphous silicon; bulk silicon wafer; double gate SOI devices; double-gate SOI MOSFET fabrication; high defect density; large grain polysilicon-on-insulator; physical properties; silicon film; Amorphous silicon; Crystalline materials; Crystallization; Degradation; Fabrication; MOSFET circuits; Microelectronics; Nickel; Semiconductor films; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 2001 IEEE International
Conference_Location
Durango, CO, USA
ISSN
1078-621X
Print_ISBN
0-7803-6739-1
Type
conf
DOI
10.1109/SOIC.2001.958001
Filename
958001
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