• DocumentCode
    1669243
  • Title

    Double-gate SOI MOSFET fabrication from bulk silicon wafer

  • Author

    Xinnan Lin ; Chuguang Feng ; Shengdong Zhang ; Wai-Hung Ho ; Mansun Chan

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
  • fYear
    2001
  • Firstpage
    93
  • Lastpage
    94
  • Abstract
    The double-gate SOI structure is believed to be the most scalable technology down to the 0.02/spl mu/m regime. However, experimental study of double-gate related phenomena has been hindered by the difficulties in fabricating double-gate devices. In this paper, a simple and yet flexible method to fabricate an experimental double-gate device is proposed. The double-gate device is actually fabricated on a silicon film recrystallized from amorphous silicon (referred as large grain polysilicon-on-insulator or LPSOI film), which is not truly single crystal SOI. However, material and device characteristics show that the film is equivalent to single crystal SOI film with high defect density, like SOI wafers produced in the early days. Thus, all physical properties of double gate SOI devices are preserved.
  • Keywords
    MOSFET; oxidation; silicon-on-insulator; 0.02 micron; LOCOS; LPSOI film; Si; amorphous silicon; bulk silicon wafer; double gate SOI devices; double-gate SOI MOSFET fabrication; high defect density; large grain polysilicon-on-insulator; physical properties; silicon film; Amorphous silicon; Crystalline materials; Crystallization; Degradation; Fabrication; MOSFET circuits; Microelectronics; Nickel; Semiconductor films; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2001 IEEE International
  • Conference_Location
    Durango, CO, USA
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-6739-1
  • Type

    conf

  • DOI
    10.1109/SOIC.2001.958001
  • Filename
    958001