Title :
The Application of Metal Deposition in Optical Sensor Technique. The Microscale Cu Deposition as “Electrochemical Welding”
Author :
Sanecki, Przemyslaw T. ; Gibala, Katarzyna ; Skital, Piotr M.
Author_Institution :
Fac. of Chem., Rzeszow Univ. of Technol., Rzeszow, Poland
Abstract :
The problem of how to attach an optical glass fiber to a copper plate was solved with the use of microscale electrolyser of special design. The respective laboratory scale technology was presented. The results were documented by photos of ready elements. The matter of relation between deposition by means of constant current electrolysis without potential control and the process realized with the use of cyclic voltammetry and chronopotentiometry techniques was raised and discussed.
Keywords :
copper; electrodeposition; fibre optic sensors; voltammetry (chemical analysis); welding; Cu; chronopotentiometry; copper plate; cyclic voltammetry; electrochemical welding; metal deposition; microscale Cu deposition; microscale electrolyser; optical glass fiber; optical sensor technique; Copper; Electrodes; Optical fiber sensors; Optical fibers; Surface treatment; Chronopotentiometry (CP); Optical fiber sensor; cyclic voltammetry (CV); fiber loaded diaphragm; flat diaphragm; metal deposition; packed-bed micro-electrolyser; solid electrodes;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2014.2345731
