DocumentCode
1670849
Title
Improving wafer fabrication performance by Hierarchical colored timed Petri-net and SA - based approach
Author
Cao, Zhengcai ; Zhao, Yingtao ; Qiao, Fei
Author_Institution
Coll. of Inf. Sci. & Technol., Beijing Univ. of Chem. Technol., Beijing, China
fYear
2010
Firstpage
4045
Lastpage
4049
Abstract
The paper describes an approach to scheduling for semiconductor wafer fabrication. In order to effectively analyze of control for semiconductor wafer fabrication, a Hierarchical colored timed Petri net (HCTPN) modeling technology based on the comprehensive analysis of the semiconductor manufacturing process was proposed. Due to the wide acceptance of priority rules in the wafer fabrication, we proposed a simulated annealing (SA) to search for the optimal combination of a number of priority rules in the HCTPN models. Computational results are presented that our approach constantly generates better solutions compared to those obtained by commonly- used dispatching rules.
Keywords
Petri nets; manufacturing processes; scheduling; semiconductor device manufacture; simulated annealing; HCTPN modeling; hierarchical colored timed Petri-net; optimal combination; scheduling; semiconductor manufacturing process; semiconductor wafer fabrication; simulated annealing; Computational modeling; Dispatching; Fabrication; Job shop scheduling; Object oriented modeling; Semiconductor device modeling; Petri net; modeling; scheduling; semiconductor wafer fabricate; simulated annealing;
fLanguage
English
Publisher
ieee
Conference_Titel
Intelligent Control and Automation (WCICA), 2010 8th World Congress on
Conference_Location
Jinan
Print_ISBN
978-1-4244-6712-9
Type
conf
DOI
10.1109/WCICA.2010.5553803
Filename
5553803
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