DocumentCode :
1670849
Title :
Improving wafer fabrication performance by Hierarchical colored timed Petri-net and SA - based approach
Author :
Cao, Zhengcai ; Zhao, Yingtao ; Qiao, Fei
Author_Institution :
Coll. of Inf. Sci. & Technol., Beijing Univ. of Chem. Technol., Beijing, China
fYear :
2010
Firstpage :
4045
Lastpage :
4049
Abstract :
The paper describes an approach to scheduling for semiconductor wafer fabrication. In order to effectively analyze of control for semiconductor wafer fabrication, a Hierarchical colored timed Petri net (HCTPN) modeling technology based on the comprehensive analysis of the semiconductor manufacturing process was proposed. Due to the wide acceptance of priority rules in the wafer fabrication, we proposed a simulated annealing (SA) to search for the optimal combination of a number of priority rules in the HCTPN models. Computational results are presented that our approach constantly generates better solutions compared to those obtained by commonly- used dispatching rules.
Keywords :
Petri nets; manufacturing processes; scheduling; semiconductor device manufacture; simulated annealing; HCTPN modeling; hierarchical colored timed Petri-net; optimal combination; scheduling; semiconductor manufacturing process; semiconductor wafer fabrication; simulated annealing; Computational modeling; Dispatching; Fabrication; Job shop scheduling; Object oriented modeling; Semiconductor device modeling; Petri net; modeling; scheduling; semiconductor wafer fabricate; simulated annealing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Intelligent Control and Automation (WCICA), 2010 8th World Congress on
Conference_Location :
Jinan
Print_ISBN :
978-1-4244-6712-9
Type :
conf
DOI :
10.1109/WCICA.2010.5553803
Filename :
5553803
Link To Document :
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