• DocumentCode
    1670849
  • Title

    Improving wafer fabrication performance by Hierarchical colored timed Petri-net and SA - based approach

  • Author

    Cao, Zhengcai ; Zhao, Yingtao ; Qiao, Fei

  • Author_Institution
    Coll. of Inf. Sci. & Technol., Beijing Univ. of Chem. Technol., Beijing, China
  • fYear
    2010
  • Firstpage
    4045
  • Lastpage
    4049
  • Abstract
    The paper describes an approach to scheduling for semiconductor wafer fabrication. In order to effectively analyze of control for semiconductor wafer fabrication, a Hierarchical colored timed Petri net (HCTPN) modeling technology based on the comprehensive analysis of the semiconductor manufacturing process was proposed. Due to the wide acceptance of priority rules in the wafer fabrication, we proposed a simulated annealing (SA) to search for the optimal combination of a number of priority rules in the HCTPN models. Computational results are presented that our approach constantly generates better solutions compared to those obtained by commonly- used dispatching rules.
  • Keywords
    Petri nets; manufacturing processes; scheduling; semiconductor device manufacture; simulated annealing; HCTPN modeling; hierarchical colored timed Petri-net; optimal combination; scheduling; semiconductor manufacturing process; semiconductor wafer fabrication; simulated annealing; Computational modeling; Dispatching; Fabrication; Job shop scheduling; Object oriented modeling; Semiconductor device modeling; Petri net; modeling; scheduling; semiconductor wafer fabricate; simulated annealing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Control and Automation (WCICA), 2010 8th World Congress on
  • Conference_Location
    Jinan
  • Print_ISBN
    978-1-4244-6712-9
  • Type

    conf

  • DOI
    10.1109/WCICA.2010.5553803
  • Filename
    5553803