Title :
A 195Gb/s 1.2W 3D-stacked inductive inter-chip wireless superconnect with transmit power control scheme
Author :
Miura, Noriyuki ; Mizoguchi, Daisuke ; Inoue, Mari ; Tsuji, Hiroo ; Sakurai, Takayasu ; Kuroda, Tadahiro
Author_Institution :
Keio Univ., Yokohama, Japan
Abstract :
An inductively coupled wireless interface achieves aggregated data rate of 195Gbit/s among 4 stacked chips in a package by arranging 195 transceivers in 50μm pitch with power dissipation of 1.2W. The transmit power is controlled in accordance to the communication distance to reduce both the power dissipation and the crosstalk of the system.
Keywords :
crosstalk; power consumption; power control; transceivers; 1.2 W; 195 Gbit/s; 3D-stacked inductive superconnect; crosstalk; inter-chip wireless superconnect; power dissipation; transceivers; transmit power control; wireless interface; CMOS technology; Circuits; Communication system control; Crosstalk; Power control; Power dissipation; Probes; Semiconductor device measurement; Transceivers; Transmitters;
Conference_Titel :
Solid-State Circuits Conference, 2005. Digest of Technical Papers. ISSCC. 2005 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-8904-2
DOI :
10.1109/ISSCC.2005.1493970
