DocumentCode
1672618
Title
Ultra-thin-film silicon-on-insulator structure using oxidized porous silicon
Author
Li, Ahen ; Huang, Yiping ; Zou, Sixun ; Tang, Tingao ; Kwor, Richard
Author_Institution
Dept. of Electron. Eng., Fudan Univ., Shanghai, China
fYear
1995
Firstpage
266
Lastpage
268
Abstract
Ultra-thin-film Silicon-On-Insulator (TFSOI) structure with 100 nm-thick and 100 μm-wide top Si islands were fabricated using the full isolation by oxidized porous silicon (FIPOS) technique. These structures were characterized using XTEM, ASP, Raman spectroscopy and electrical breakdown measurement. The results indicate that the TFSOI structures are of high quality and the Si islands are fully isolated
Keywords
Raman spectra; electric breakdown; island structure; isolation technology; oxidation; porous materials; silicon-on-insulator; transmission electron microscopy; ASP; FIPOS; Raman spectroscopy; Si islands; Si-SiO2; TFSOI; XTEM; electrical breakdown; fabrication; full isolation by oxidized porous silicon; ultra-thin-film silicon-on-insulator structure; Doping; Epitaxial growth; Etching; Frequency; Oxidation; Raman scattering; Silicon on insulator technology; Spectroscopy; Stress measurement; Tensile stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1995 4th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-3062-5
Type
conf
DOI
10.1109/ICSICT.1995.500082
Filename
500082
Link To Document