Thin-film as enabling passive integration technology for RF SoC and SiP

Author

Carchon, Geert ; Sun, Xiao ; Posada, Guillermo ; Linten, Dimitri ; Beyne, Eric

Author_Institution

IMEC, Leuven, Belgium

fYear

2005

Firstpage

398

Abstract

Thin-film Cu/BCB technology with integrated inductors, resistors and capacitors is described for the realization of high-quality on-chip and in-package Si-based passive elements. Thin-film SiP and SoC inductor and transmission line performance is compared. A SiP 7GHz power splitter, a 50GHz BPF, and two 90nm CMOS VCO operating at 5.8GHz and 15GHz with on-chip thin-film inductors are discussed.

Keywords

CMOS integrated circuits; band-pass filters; copper; radiofrequency integrated circuits; silicon; system-on-chip; thin film capacitors; thin film inductors; thin film resistors; voltage-controlled oscillators; 15 GHz; 5.8 GHz; 50 GHz; 7 GHz; 90 nm; BPF; CMOS VCO; RF SoC; SiP; capacitors; in-package Si-based passive elements; integrated inductors; on-chip Si-based passive elements; on-chip thin-film inductors; passive integration technology; power splitter; resistors; thin-film Cu/BCB technology; transmission line performance; CMOS technology; Coplanar waveguides; Glass; Integrated circuit interconnections; Parasitic capacitance; Radio frequency; Semiconductor thin films; Substrates; Thin film inductors; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference, 2005. Digest of Technical Papers. ISSCC. 2005 IEEE International

Conference_Location

San Francisco, CA

ISSN

0193-6530

Print_ISBN

0-7803-8904-2

Type

conf

DOI

10.1109/ISSCC.2005.1494037

Filename

1494037