DocumentCode :
1673240
Title :
High-power and high-efficiency AlGaN/GaN HEMT operated at 50 V drain bias voltage
Author :
Kikkawa, T. ; Nagahara, M. ; Adachi, N. ; Yokokawa, S. ; Kato, S. ; Yokoyama, M. ; Kanamura, M. ; Yamaguchi, Y. ; Hara, N. ; Joshin, K.
Author_Institution :
Fujitsu Labs. Ltd., Kanagawa, Japan
fYear :
2003
Firstpage :
167
Lastpage :
170
Abstract :
We describe high power 70 W CW operation at 52 V drain bias voltage (Vds) using 24-mm gate-periphery AlGaN/GaN HEMTs on SiC substrate. A 48 W output power with the drain efficiency of 60% was also obtained at Vds of 50 V under the efficiency-matched condition near class-B. At 40 V, the drain efficiency reached 68%. Vds dependence of third order-intermodulation (IM3) was also characterized at Vds up to 50 V. This is the first report about IM3 profile characterization for a large gate-periphery device at Vds of 50 V. We also investigated RF-stress life test at Vds up to 40 V. The AlGaN/GaN HEMT in this study exhibited good reliability over 100 h.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; intermodulation; life testing; power HEMT; semiconductor device reliability; wide band gap semiconductors; 40 V; 48 W; 50 V; 60 percent; 68 percent; 70 W; AlGaN-GaN; AlGaN/GaN HEMT; CW operation; RF-stress life test; SiC; SiC substrate; class-B operation; drain efficiency; high-power high-efficiency device; large gate-periphery device; output power; reliability; third-order intermodulation; Aluminum gallium nitride; Base stations; Gallium nitride; HEMTs; Linearity; Power amplifiers; Power generation; Silicon carbide; Silicon compounds; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radio Frequency Integrated Circuits (RFIC) Symposium, 2003 IEEE
ISSN :
1529-2517
Print_ISBN :
0-7803-7694-3
Type :
conf
DOI :
10.1109/RFIC.2003.1213918
Filename :
1213918
Link To Document :
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