• DocumentCode
    1673240
  • Title

    High-power and high-efficiency AlGaN/GaN HEMT operated at 50 V drain bias voltage

  • Author

    Kikkawa, T. ; Nagahara, M. ; Adachi, N. ; Yokokawa, S. ; Kato, S. ; Yokoyama, M. ; Kanamura, M. ; Yamaguchi, Y. ; Hara, N. ; Joshin, K.

  • Author_Institution
    Fujitsu Labs. Ltd., Kanagawa, Japan
  • fYear
    2003
  • Firstpage
    167
  • Lastpage
    170
  • Abstract
    We describe high power 70 W CW operation at 52 V drain bias voltage (Vds) using 24-mm gate-periphery AlGaN/GaN HEMTs on SiC substrate. A 48 W output power with the drain efficiency of 60% was also obtained at Vds of 50 V under the efficiency-matched condition near class-B. At 40 V, the drain efficiency reached 68%. Vds dependence of third order-intermodulation (IM3) was also characterized at Vds up to 50 V. This is the first report about IM3 profile characterization for a large gate-periphery device at Vds of 50 V. We also investigated RF-stress life test at Vds up to 40 V. The AlGaN/GaN HEMT in this study exhibited good reliability over 100 h.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; intermodulation; life testing; power HEMT; semiconductor device reliability; wide band gap semiconductors; 40 V; 48 W; 50 V; 60 percent; 68 percent; 70 W; AlGaN-GaN; AlGaN/GaN HEMT; CW operation; RF-stress life test; SiC; SiC substrate; class-B operation; drain efficiency; high-power high-efficiency device; large gate-periphery device; output power; reliability; third-order intermodulation; Aluminum gallium nitride; Base stations; Gallium nitride; HEMTs; Linearity; Power amplifiers; Power generation; Silicon carbide; Silicon compounds; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radio Frequency Integrated Circuits (RFIC) Symposium, 2003 IEEE
  • ISSN
    1529-2517
  • Print_ISBN
    0-7803-7694-3
  • Type

    conf

  • DOI
    10.1109/RFIC.2003.1213918
  • Filename
    1213918