Title :
Impact of thermal cycle on end-face geometry of laser processed LC and standard LC connectors
Author :
Thongdaeng, R. ; Wangsan, S. ; Berdinskikh, Tatiana ; Suurmann, R. ; Culbert, J.M. ; Hogberg, D.
Author_Institution :
Optronics Lab., Celestica Thailand, Chonburi, Thailand
Abstract :
This paper investigates the impact of thermal cycle on geometry of laser processed and standard LC/PC connectors. All connectors were separated into four groups: 1) unmated & stored at room temperature, 2) mated & stored at room temperature, 3) unmated during thermal cycle, and 4) mated during thermal cycle. Groups 1 & 2 were stored at room temperature for 7 days. The thermal cycle was performed on Groups 3 & 4 during 7 days based on GR-326 requirements. Radius of curvature, apex offset and fiber height were measured before and after those 7 days. The fiber withdrawal up to 100 nm is found in Group 4, but no changes are observed in Groups 1-3. After Group 4 underwent the 2nd and 3rd thermal cycles (1 week/cycle), an insignificant change in fiber height is found. In addition, there is no significant change in fiber height for the unmated connectors in Group 4 after 1 year stored at room temperature.
Keywords :
geometrical optics; laser materials processing; LC/PC connectors; end-face geometry; laser processed LC; standard LC connectors; temperature 293 K to 298 K; thermal cycle; time 7 day; Fiber Withdrawal; Laser Processed LC connector; Thermal Cycle Test;
Conference_Titel :
Optical Communications and Networks (ICOCN), 2012 11th International Conference on
Conference_Location :
Chonburi
Print_ISBN :
978-1-4673-4957-4
Electronic_ISBN :
978-1-4673-4958-1
DOI :
10.1109/ICOCN.2012.6486231