Title :
3Gb/s AC-coupled chip-to-chip communication using a low-swing pulse receiver
Author :
Luo, Lei ; Wilson, John M. ; Mick, Stephen E. ; Xu, Jian ; Zhang, Liang ; Franzon, Paul D.
Author_Institution :
North Carolina State Univ., Raleigh, NC, USA
Abstract :
A 3Gbit/s 60mV low-swing pulse receiver is presented for AC-coupled interconnect (ACCI). Using this receiver, we demonstrate without errors, chip-to-chip communication through an ACCI channel with 150fF coupling capacitors, across 15cm FR4 microstrip line. A test chip is fabricated in 0.18 μm CMOS technology and the TX and RX dissipate 15mW per I/O at 3Gbit/s.
Keywords :
CMOS integrated circuits; integrated circuit interconnections; microstrip lines; receivers; 0.18 micron; 15 mW; 150 fF; 3 Gbit/s; 60 mV; AC-coupled chip-to-chip communication; AC-coupled interconnect; ACCI; CMOS technology; coupling capacitors; low-swing pulse receiver; microstrip line; Capacitors; Circuit testing; Clocks; Coupling circuits; Feedback; Integrated circuit interconnections; Inverters; Optical signal processing; Packaging; Pulse amplifiers;
Conference_Titel :
Solid-State Circuits Conference, 2005. Digest of Technical Papers. ISSCC. 2005 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-8904-2
DOI :
10.1109/ISSCC.2005.1494099
