DocumentCode
1674593
Title
Evaluation of metal post interconnected parallel plate structure for power electronic building blocks
Author
Siddabattula, Kalyan ; Chen, Zhou ; Boroyevich, Dushan
Author_Institution
Bradley Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Volume
1
fYear
2000
fDate
6/22/1905 12:00:00 AM
Firstpage
271
Abstract
This paper evaluates metal post interconnected parallel plate structure (MPIPPS) adopted for the power electronic building blocks (PEBB) packaging program in terms of parasitic elements involved in the layout design, current distribution and its impact on electrical performance. It also compares this technology with the more conventional wire-bond technology. Electrical performance predicted by INCA, Maxwell, and PSPICE is verified with an experimental setup
Keywords
packaging; power electronics; INCA; Maxwell; PSPICE; electrical performance; metal post interconnected parallel plate structure; packaging program; parasitic elements; power electronic building blocks; wire-bond technology; Conducting materials; Current distribution; Diodes; Electronic packaging thermal management; Inductance; Inverters; Power electronics; Power system interconnection; Switches; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 2000. APEC 2000. Fifteenth Annual IEEE
Conference_Location
New Orleans, LA
Print_ISBN
0-7803-5864-3
Type
conf
DOI
10.1109/APEC.2000.826115
Filename
826115
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