DocumentCode
1675001
Title
Trade-offs between SiGe and GaAs bipolar ICs
Author
Ning, Tak H.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
1995
Firstpage
434
Lastpage
438
Abstract
The intrinsic physical properties and electrical parameters of SiGe and GaAs heterojunction bipolar transistors (HBTs) are compared and discussed. The reported performance of the two devices are comparable. At the same but relatively low current densities, GaAs HBTs are faster than SiGe HBTs. However, SiGe HBTs not using SOI can be designed to operate at much higher current densities by using smaller emitters, resulting in much lower power dissipation and potentially higher performance, but larger substrate-coupling noise, than GaAs HBTs
Keywords
Ge-Si alloys; III-V semiconductors; bipolar integrated circuits; gallium arsenide; heterojunction bipolar transistors; integrated circuit design; integrated circuit noise; semiconductor materials; GaAs; SiGe; bipolar ICs; current densities; electrical parameters; heterojunction bipolar transistors; intrinsic physical properties; power dissipation; substrate-coupling noise; Capacitance; Current density; Dielectric constant; Electron mobility; Gallium arsenide; Germanium silicon alloys; Heterojunction bipolar transistors; Silicon germanium; Silicon on insulator technology; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1995 4th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-3062-5
Type
conf
DOI
10.1109/ICSICT.1995.500188
Filename
500188
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