DocumentCode
1675607
Title
Al-SiO/sub 2/-Al sandwich microstrip lines for on-chip interconnects up to 400 GHz
Author
von Kamienski, E.S. ; Gondermann, J. ; Roskos, H.G. ; Kurz, H.
Author_Institution
Inst. fuer Halbleitertechnik, RWTH, Aachen, Germany
fYear
1993
Firstpage
393
Abstract
A downscaled 2- mu m-wide microstrip line fabricated with both signal and ground conductors on top of the substrate is presented. A significantly reduced geometric dispersion for 400-GHz bandwidth pulse was measured on this waveguide, using the time-resolved electrooptic sampling technique. The mode of the electromagnetic signal is strongly confined, promising reduced crosstalk between densely packed interconnects.<>
Keywords
aluminium; crosstalk; metallisation; microstrip lines; silicon compounds; 400 GHz; Al-SiO/sub 2/-Al; crosstalk; densely packed interconnects; electromagnetic signal; geometric dispersion; ground conductors; microstrip line; on-chip interconnects; signal conductors; time-resolved electrooptic sampling technique; Bandwidth; Conductors; Crosstalk; Dispersion; Electromagnetic measurements; Electromagnetic waveguides; Electrooptical waveguides; Microstrip; Pulse measurements; Sampling methods;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1993., IEEE MTT-S International
Conference_Location
Atlanta, GA, USA
ISSN
0149-645X
Print_ISBN
0-7803-1209-0
Type
conf
DOI
10.1109/MWSYM.1993.276795
Filename
276795
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