• DocumentCode
    1675993
  • Title

    Utilizing parametric modeling design software in the motor manufacturing industry

  • Author

    Acheson, Douglas C.

  • Author_Institution
    Indiana Univ., Indianapolis, IN, USA
  • fYear
    1999
  • fDate
    6/21/1905 12:00:00 AM
  • Firstpage
    23
  • Lastpage
    27
  • Abstract
    In today´s global economy, every advantage must be utilized to remain competitive. Reduced product development times have become a critical component in the matrix of bringing quality consumer goods to market. This paper suggests the implementation of 3 dimensional mechanical computer aided design (MCAD) software (specifically parametric packages) as well as other technologies that are shaping the way we will do business in the new millennium. In addition to MCAD tools, collaborative design environments (not based on geographical constraints) are rapidly becoming the standard corporate model. Namely, collaborative Internet environments. It should be obvious that the Internet is merely in its infancy stage at this point and is poised to weave itself into every corner of the business sector (and much of our personal lives as well). An additional focus of this paper is to provide background information on several new technologies that should be considered for use in virtually all design and manufacturing facilities
  • Keywords
    electric machine CAD; electric motors; manufacturing industries; mechanical engineering computing; product development; 3D mechanical CAD software; collaborative Internet environments; collaborative design environments; consumer goods; motor manufacturing industry; parametric modeling design software; product development time; time-to-market; Business; Collaboration; Collaborative tools; Internet; Packaging; Parametric statistics; Product development; Production facilities; Software design; Software packages;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1999. Proceedings
  • Conference_Location
    Cincinnati, OH
  • ISSN
    0362-2479
  • Print_ISBN
    0-7803-5757-4
  • Type

    conf

  • DOI
    10.1109/EEIC.1999.826174
  • Filename
    826174