High yield multichip modules based on minimal IC pretest

In order to attain the high yields that are a must for every MCM manufacturer, components used in the fabrication of MCMs must be screened for visual and performance defects. As GE CRD and other MCM manufacturers continue efforts to improve MCM yields, a proven IC pretest methodology for affecting high, first-pass MCM yield has been established by GE CRD. This paper presents the approach, as developed and implemented in the absence of an industry accepted “Known Good Die” process, based on GE CRD´s experience of screening components after wafer level test. Using this pretest methodology, it has been shown that high MCM yields can be achieved through a combination of Military Standard 883 2010A visual inspection and minimal IC pretest, without need for burn-in