Title :
Feasibility study of smart substrate multichip modules
Author :
Gattiker, Anne E. ; Maly, Wojciech
Author_Institution :
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Abstract :
This paper analyzes the feasibility of MCMs using active silicon substrates with built-in resting circuitry. It identifies the domain of applicability of such MCMs and points to limitations of the “Known Good Die” approach
Keywords :
economics; elemental semiconductors; integrated circuit manufacture; integrated circuit testing; intelligent materials; multichip modules; silicon; substrates; Known Good Die; MCM; Si; active silicon substrates; built-in resting circuitry; cost model; prototype; smart substrate multichip modules; Assembly systems; Circuit faults; Circuit testing; Costs; Multichip modules; Packaging; Pins; Probes; Silicon; System testing;
Conference_Titel :
Test Conference, 1994. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-2103-0
DOI :
10.1109/TEST.1994.527934
