• DocumentCode
    1676616
  • Title

    Experimental and numerical investigations for CF4 decomposition using RF low pressure plasma

  • Author

    Kuroki, Tomoyuki ; Tanaka, Shingo ; Okubo, Masaaki ; Yamamoto, Toshiaki

  • Author_Institution
    Dept. of Energy Syst. Eng., Osaka Prefecture Univ., Japan
  • Volume
    1
  • fYear
    2004
  • Lastpage
    599
  • Abstract
    Among perfluorocompounds (PFCs), we focused on CF4 used in semiconductor manufacturing process which was considered as one of the most difficult to decompose gas. We have investigated the decomposition of CF4 using the inductively coupled plasma (ICP) reactor with RF power supply. This technology was confirmed to achieve a high efficiency and more economical system in comparison with the conventional system. The reaction products such as CO, CO2 and COF2 upon CF4 decomposition were measured using a CO2 analyzer and an FTIR. The mechanisms of CF4 decomposition through the analysis of reaction products and numerical simulations were studied. Numerical simulation was carried out to obtain gas temperature, electron temperature, electron number density and chemical species number density distribution to cope with CF4 decomposition in the ICP reactor.
  • Keywords
    Fourier transform spectra; flue gases; infrared spectra; numerical analysis; plasma applications; plasma devices; semiconductor device manufacture; CF4; RF power supply; chemical species number density distribution; electron number density; electron temperature; gas temperature; inductively coupled plasma; low pressure plasma; numerical simulations; perfluorocompounds; reaction product analysis; semiconductor manufacturing process; Electrons; Inductors; Manufacturing processes; Numerical simulation; Plasma materials processing; Plasma temperature; Power supplies; Power system economics; Radio frequency; Temperature distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Conference, 2004. 39th IAS Annual Meeting. Conference Record of the 2004 IEEE
  • ISSN
    0197-2618
  • Print_ISBN
    0-7803-8486-5
  • Type

    conf

  • DOI
    10.1109/IAS.2004.1348466
  • Filename
    1348466