Title :
Optical design of head-mounted projective display for vein imaging
Author :
Yi Zhai ; Zhaoqi Wang ; Yongji Liu ; Yuanqing He
Author_Institution :
Inst. of Modern Opt., Nankai Univ., Tianjin, China
Abstract :
A novel head-mounted projective display (HMPD) for vein imaging is proposed in this paper. The correspondent optical system is designed, which consists of imaging system and see-through HMPD. The infrared imaging system has a large numerical aperture with F number of 2.6, which is extremely conducive to receive and to image the weak reflected near-infrared light from the patient´s skin surface. The resolution of the imaging system is QXGA (2048 × 1536). The see-through HMPD possesses an 18mm exit pupil and a 25mm eye relief, with ultra-light in weight, compact in structure and comfort in wearing. Meanwhile, it has a satisfactory performance for vein imaging that the field curvature is less than 0.03D, the distortion is less than 0.32% and the resolution is up to QXGA. The structure of the optical system of HMPD is consistent to that of infrared imaging part, which is conducive to simplify the processing and assembly in manufacture. The proposed visual instrument for vein display is suitable for supplementing existing venipuncture techniques.
Keywords :
CCD image sensors; biomedical imaging; biomedical transducers; blood vessels; body sensor networks; helmet mounted displays; image resolution; infrared imaging; optical sensors; skin; CCD detector; F number; QXGA; head-mounted projective display; imaging resolution; infrared imaging system; near-infrared light reflection; numerical aperture; optical system design; patient skin surface; see-through HMPD; size 18 mm; size 25 mm; vein imaging system; venipuncture technique; visual instrument; Biomedical optical imaging; Educational institutions; Image resolution; Optical distortion; Optical imaging; Optical reflection; Veins; head-mounted projective display; optical design; vein imaging;
Conference_Titel :
Electronics, Computer and Applications, 2014 IEEE Workshop on
Conference_Location :
Ottawa, ON
DOI :
10.1109/IWECA.2014.6845741