Integrated 155M-10Gbps Framer with 22.5Gbps Low/High Order Cross Connect SoC

Author

Venkataraman, K. ; Suresh, V. ; Iyengar, S. ; Ott, M. ; Kalari, S.R. ; Zhi, J. ; Ruetz, E. ; Gray, M. ; Reynov, B. ; Iqbal, A.

Author_Institution

Crimson Microsyst., Inc., Sunnyvale, CA

fYear

2006

Firstpage

101

Lastpage

104

Abstract

The advent of broadband services requires multi service provisioning platforms (MSPP) to achieve >10Gbps capacity with 1-4 rack unit footprint, power <200W and cost <$10K. Highly integrated SoC using 0.13mu CMOS 19.3times19.3mm die packaged in a 1517 FCBGA affords a unique MSPP solution consisting of 155M-10Gbps SONET/SDH framing, low/high order path processing, grooming, cross-connection up to 22.5Gbps and an embedded processor. A rigorous methodology enabled a production-worthy SoC comprising 9Mgates/14Mbit memory

Keywords

CMOS integrated circuits; ball grid arrays; microprocessor chips; system-on-chip; 0.13 micron; 14 Mbit; 22.5 Gbit/s; CMOS integrated circuit; FCBGA; SONET/SDH framing; broadband services; cross-connection; die packaged; embedded processor; highly integrated SoC; integrated framer; low/high order SoC; low/high order path processing; multiservice provisioning platforms; Built-in self-test; Costs; Fabrics; Payloads; SONET; Silicon; Switches; Synchronous digital hierarchy; System testing; Time division multiplexing;

fLanguage

English

Publisher

ieee

Conference_Titel

Custom Integrated Circuits Conference, 2006. CICC '06. IEEE

Conference_Location

San Jose, CA

Print_ISBN

1-4244-0075-9

Electronic_ISBN

1-4244-0076-7

Type

conf

DOI

10.1109/CICC.2006.321002

Filename

4114918