DocumentCode
1677646
Title
Modeling, Design, and Verification for the Analog Front-end of a MEMS-based Parallel Scanning-probe Storage Device
Author
Hagleitner, C. ; Bonaccio, T. ; Rothuizen, H. ; Wiesmann, D. ; Lienemann, J. ; Korvink, J. ; Cherubini, G. ; Eleftheriou, E.
Author_Institution
IBM Zurich Res. Lab.
fYear
2006
Firstpage
193
Lastpage
196
Abstract
The paper presents an integrated analog front-end (AFE) for the read-channel of a parallel scanning-probe storage device. The read/write element is based on an array of microfabricated silicon cantilevers equipped with heating elements to form nanometer-sized indentations in a polymer surface using integral atomic-force microscopy (AFM) tips. A detailed model based on a combination of a thermal/electrical lumped-element model and behavioral model of the electrostatic/mechanical part was developed. The behavioral model of the electrostatic/mechanical part is automatically generated from a full finite-element model (FEM). The model is completely implemented in Verilog-A and was used to co-develop the integrated analog front-end circuitry together with the read/write cantilever. The model and the analog front-end were simulated together and the results were experimentally verified. The approach chosen is well suited for system-level simulation and verification/extraction in a design environment based on standard EDA tools
Keywords
cantilevers; digital storage; finite element analysis; micromechanical devices; readout electronics; sensors; AFM; EDA tool; MEMS-based parallel scanning-probe storage device; Verilog-A; electrostatic-mechanical part model; finite-element model; heating elements; integral atomic-force microscopy tips; integrated analog front-end; microfabricated silicon cantilevers; polymer surface; read-channel; read/write cantilever; system-level simulation; thermal-electrical lumped-element; Atomic force microscopy; Circuit simulation; Electric resistance; Electrostatics; Hardware design languages; Polymers; Resistance heating; Silicon; Surface resistance; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 2006. CICC '06. IEEE
Conference_Location
San Jose, CA
Print_ISBN
1-4244-0075-9
Electronic_ISBN
1-4244-0076-7
Type
conf
DOI
10.1109/CICC.2006.320886
Filename
4114937
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