DocumentCode
1677826
Title
Flexible epoxy for low stress electronic component encapsulation
Author
Phenis, Michael T.
Author_Institution
Lord Chem. Products, Thermoset Plastics Inc., USA
fYear
1999
fDate
6/21/1905 12:00:00 AM
Firstpage
453
Lastpage
458
Abstract
The following report compares the physical and mechanical properties of the new Thermoset ES-100 flexible epoxy material with two of the top flexible epoxy materials currently available on the market today. One of these materials is from a domestic US manufacturer and the other is from an overseas manufacturer. This report focuses on the thermal aging characteristics of these epoxy materials along with their chemical resistance and resistance to moisture
Keywords
ageing; electric breakdown; encapsulation; epoxy insulation; insulation testing; mechanical properties; Thermoset ES-100 flexible epoxy material; chemical resistance; insulation breakdown testing; low-stress electronic component encapsulation; moisture resistance; thermal aging characteristics; Chemicals; Circuits; Electronic components; Encapsulation; Manufacturing; Mechanical factors; Moisture; Temperature; Thermal resistance; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1999. Proceedings
Conference_Location
Cincinnati, OH
ISSN
0362-2479
Print_ISBN
0-7803-5757-4
Type
conf
DOI
10.1109/EEIC.1999.826253
Filename
826253
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