• DocumentCode
    1677931
  • Title

    Fine rectangular magnet wires with ultra thin insulation and its applications

  • Author

    Kuroki, Hidetaka

  • Author_Institution
    Mitsubishi Cable Ind. Ltd., Tokyo, Japan
  • fYear
    1999
  • fDate
    6/21/1905 12:00:00 AM
  • Firstpage
    489
  • Lastpage
    495
  • Abstract
    Typically rectangular magnet wires have been used for conductors larger than approx. 2 sq.mm. Fine rectangular wires showed poor performance, because of difficulties in building uniform insulation on fine rectangular conductors. Conventionally, round magnet wires were used for fine sizes. Mitsubishi Cable Industries, Ltd., have developed MEDIS (Mitsubishi Electro-Deposition Insulating System) which is a very unique system for producing magnet wires. We developed a fine rectangular magnet wire (“SX WIRE”) with very good performance through this MEDIS process. We were also successful in making an ultra thin insulation with very good uniformity. The following issues are reported in this paper: fine rectangular magnet wires by MEDIS; ultra thin insulation (min. 0.001 mm) rectangular magnet wires; characteristics of ultra thin insulation wires; advanced MEDIS process for fine rectangular magnet wires; and applications and advantages of applied devices
  • Keywords
    electrodeposits; insulated wires; insulating coatings; magnets; manufacture; MEDIS; Mitsubishi Cable Industries; Mitsubishi Electro-Deposition Insulating System; SX WIRE; conductors; dip coat process; fine rectangular magnet wire; fine rectangular magnet wires; rectangular magnet wires; round magnet wires; ultra thin insulation; ultra thin insulation wires; uniform insulation; Cable insulation; Conductors; Dielectrics and electrical insulation; Electric shock; Electronics packaging; Floors; Manufacturing processes; Resins; Stress; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1999. Proceedings
  • Conference_Location
    Cincinnati, OH
  • ISSN
    0362-2479
  • Print_ISBN
    0-7803-5757-4
  • Type

    conf

  • DOI
    10.1109/EEIC.1999.826259
  • Filename
    826259