Title :
Electrical characterization of packages for use with GaAs MMIC amplifiers
Author :
Smith, S.R. ; Murphy, M.T.
Abstract :
A test methodology is presented which combines the advantages of on-wafer RF probing with a TRL (through-reflect-line) calibration to create a completely de-embeddable, novel ´test fixture´ capable of electrically characterizing nearly any style package or device. This scheme has been used to characterize many of the currently available packages for MMIC (monolithic microwave integrated circuit) amplifier products which cover frequencies up to 12 GHz. In addition, the technique has been employed to characterize injection-molded plastic packages and to evaluate nonprobable MMICs.<>
Keywords :
III-V semiconductors; MMIC; gallium arsenide; integrated circuit testing; microwave amplifiers; packaging; GaAs; MMIC amplifiers; deembeddable test fixture; injection-molded plastic packages; on-wafer RF probing; packages; test methodology; through-reflect-line calibration; Calibration; Circuit testing; Fixtures; Gallium arsenide; Integrated circuit packaging; MMICs; Microwave devices; Microwave integrated circuits; Radio frequency; Radiofrequency amplifiers;
Conference_Titel :
Microwave Symposium Digest, 1993., IEEE MTT-S International
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-1209-0
DOI :
10.1109/MWSYM.1993.276926
