• DocumentCode
    1679370
  • Title

    Spreading Diversity in Multi-cell Neutron-Induced Upsets with Device Scaling

  • Author

    Ibe, E. ; Chung, S.S. ; ShiJie Wen ; Yamaguchi, H. ; Yahagi, Y. ; Kameyama, H. ; Yamamoto, S. ; Akioka, T.

  • Author_Institution
    Production Eng. Res. Lab., Hitachi Ltd., Yokohama
  • fYear
    2006
  • Firstpage
    437
  • Lastpage
    444
  • Abstract
    Recent diversity in multicell upset (MCU) of CMOS SRAMs are reviewed and scaling effects are discussed. Space and time domain automatic classification techniques are developed and applied to single event upsets (SEUs) of 130nm SRAM under quasi-mono energetic neutron irradiation at TSL and CYRIC. Tests show very high dependency of MCU features on data patterns, typically "All `0\´/`1\´" and checkerboard. Three error propagation categories with 41 modes inherent in device architectures are identified. Novel MCU features, in which errors can be corrected by rewriting but Idd increases stepwise depending on MCU multiplicity, are identified. With "All `0\´/`1\´" pattern, ratio of double bit error is found to be even higher than that of single bit errors. The majority of the double bit error is in nearest neighborhood (NN) position along word line (WL). Underlining basic mechanism can be either charge collection-diffusion or parasitic bipolar actions. But most features can be elucidated only fully by a novel MCU mechanism MCBI (multi-coupled bipolar interaction) proposed by the authors, giving clues for SEU tolerant sub-100nm design
  • Keywords
    CMOS memory circuits; SRAM chips; radiation hardening (electronics); CMOS technology; SRAM chips; charge collection-diffusion; double bit error; multicell upset; multicoupled bipolar interaction; neutron irradiation; single event upsets; CMOS technology; Circuits; Identity-based encryption; Laboratories; Neutrons; Production systems; Random access memory; Single event transient; Space technology; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2006. CICC '06. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    1-4244-0075-9
  • Type

    conf

  • DOI
    10.1109/CICC.2006.321010
  • Filename
    4114997