Full-wave analysis of discontinuities in uniplanar and multiplanar transmission lines using the frequency-domain TLM method

The authors introduce a rigorous analysis of a variety of transmission line transition discontinuities and module interconnect assemblies in MMIC (monolithic microwave integrated circuit) and miniature MIC circuits using the frequency-domain TLM (transmission line matrix) method. Numerical results on frequency-dependent S-parameters are presented which include the effect of finite thickness and conductivity of the metallization as well as mode interaction between cascaded discontinuities. The effect of inserting an intermediate section of transmission line between two different transmission media is analyzed, and it is found that CPW transitions can be made more broadband. The effects of the bonding wire for module assemblies are investigated. Itis found that the properties of the interconnect largely depend on the total length of the wire and are quite insensitive to the shape of the wire. This is in good agreement with experimental observations.<>