• DocumentCode
    1679960
  • Title

    The UltraSPARC T1 Processor: CMT Reliability

  • Author

    Leon, Ana Sonia ; Langley, Brian ; Shin, Jinuk Luke

  • Author_Institution
    Sun Microsystems Inc., Sunnyvale, CA
  • fYear
    2006
  • Firstpage
    555
  • Lastpage
    562
  • Abstract
    Throughput computing represents a new paradigm in processor design focusing on maximizing overall throughput of commercial workloads while addressing increasing demands for improved power, cooling and reliability in today\´s datacenters. The first generation of "Niagara" SPARC processors implements a power-efficient chip multithreading (CMT) architecture to deliver high performance and reliability in a low power and thermal envelope. The UltraSPARC T1 processor combines eight 4-threaded 64b cores, a high bandwidth interconnect crossbar, a shared 3MB L2 cache and four double-width DDR2 DRAM interfaces. Implemented in 90nm CMOS technology, the 378mm2 die consumes only 63W at 1.2GHz. Beyond the ability of CMT to optimize throughput performance, this paper highlights the advantages of CMT in the areas of power and thermal control, reliability, RAS, and design robustness, describing key features of the design relevant to each of these topics
  • Keywords
    integrated circuit design; integrated circuit reliability; low-power electronics; multi-threading; process design; 1.2 GHz; 63 W; 90 nm; CMOS technology; CMT reliability; Niagara processor; UltraSPARC T1 processor; alpha particles; channel hot carrier; chip reliability; electromigration; error correcting code; gate-oxide integrity; negative bias temperature instability; parity protection; power management; power-efficient chip multithreading architecture; processor design; reliability-aware; soft error rate; thermal management; throughput computing; throughput performance; Bandwidth; CMOS technology; Computer architecture; Cooling; Design optimization; Multithreading; Power generation; Process design; Random access memory; Throughput; Availability; Channel Hot Carrier (CHC); Chip MultiThreading (CMT); Electromigration (EM); Error Correcting Code (ECC); Gate-Oxide Integrity (GOI); Negative Bias Temperature Instability (NBTI); Niagara processor; Reliability; Serviceability (RAS); Soft Error Rate (SER) redundancy; UltraSPARC T1; alpha particles; chip reliability; low power; multicore; parity protection; power management; reliability-aware; thermal management; throughput performance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2006. CICC '06. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    1-4244-0075-9
  • Electronic_ISBN
    1-4244-0076-7
  • Type

    conf

  • DOI
    10.1109/CICC.2006.320989
  • Filename
    4115021