The impact of three-dimensional morphological changes and local properties induced by plasma treatment on polyimide films at the interface with some electronic components

The morphological features and local properties of an semi-alicyclic polyimide film were closely evaluated by atomic force microscopy (AFM). These characteristics were optimized by applying high frequency plasma treatment, in order to increase their suitability for electronic purposes. Starting from the surface texture parameters, a deep analysis of the surface topographies at the interface with certain compounds was performed. The action of the plasma species generates a prevalent granular surface morphology, with higher roughness, improved bearing characteristics and minimal surface orientation. In addition, after the plasma treatment, a greater interaction between the AFM silicon tip and the polyimide film occurred, reflecting an increased surface adhesion. The obtained data reveal that the processed semi-alicyclic polyimide exhibits optimal features for microelectronic applications such as silicon/polyimide interfaces for flexible electronics.