DocumentCode :
1680059
Title :
Chip-to-Chip Inductive Wireless Power Transmission System for SiP Applications
Author :
Onizuka, Kohei ; Kawaguchi, Hiroshi ; Takamiya, Makoto ; Kuroda, Tadahiro ; Sakurai, Takayasu
Author_Institution :
Inst. of Ind. Sci., Tokyo Univ.
fYear :
2006
Firstpage :
575
Lastpage :
578
Abstract :
A chip-to-chip inductive wireless power transmission system is proposed and the feasibility is experimentally demonstrated for the first time. The circuit realized 2.5mW power transmission at the output DC voltage of 0.5V using 700 times 700mum on-chip planar inductors for the transmitter and the receiver. Methods to optimize the circuit design about the maximum transmission power and the simulated optimization results are discussed
Keywords :
inductive power transmission; integrated circuit design; system-in-package; 0.5 V; 2.5 mW; SiP applications; chip-to-chip inductive wireless power transmission system; circuit design; maximum transmission power; Bonding; Circuits; Costs; Data communication; Diodes; Fabrication; Inductors; Power transmission; Radio transmitters; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference, 2006. CICC '06. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
1-4244-0075-9
Electronic_ISBN :
1-4244-0076-7
Type :
conf
DOI :
10.1109/CICC.2006.320994
Filename :
4115025
Link To Document :
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