DocumentCode
1680071
Title
Investigations on the reduction of package densities in coplanar circuits
Author
Becks, T. ; Wolff, I.
Author_Institution
Inst. for Mobile & Satellite Commun. Tech., Kamp-Lintfort, Germany
fYear
1993
Firstpage
869
Abstract
A modified method for calculating generalized scattering parameters for neighboring coplanar lines is presented. A full-wave method is used to analyze important parameters such as insertion loss, isolation, and reflection not only for the coplanar mode but also for conversion to the coupled slot line mode. The proposed method is used to analyze various coplanar structures printed on a GaAs substrate of finite height 410 mu m without lower ground metallization and shielding. Numerical results as a function of frequency and distance for approximately 50 Omega lines are obtained.<>
Keywords
MMIC; S-matrix theory; losses; microstrip components; packaging; transmission line theory; 410 micron; CPW; GaAs substrate; MMIC; coplanar circuits; coplanar lines; coupled slot line mode; full-wave method; generalized scattering parameters; insertion loss; isolation; package densities; reflection; Apertures; Conductors; Coplanar waveguides; Coupling circuits; Electromagnetic fields; Impedance; Metallization; Microstrip; Packaging; Scattering parameters;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1993., IEEE MTT-S International
Conference_Location
Atlanta, GA, USA
ISSN
0149-645X
Print_ISBN
0-7803-1209-0
Type
conf
DOI
10.1109/MWSYM.1993.277024
Filename
277024
Link To Document