• DocumentCode
    1680071
  • Title

    Investigations on the reduction of package densities in coplanar circuits

  • Author

    Becks, T. ; Wolff, I.

  • Author_Institution
    Inst. for Mobile & Satellite Commun. Tech., Kamp-Lintfort, Germany
  • fYear
    1993
  • Firstpage
    869
  • Abstract
    A modified method for calculating generalized scattering parameters for neighboring coplanar lines is presented. A full-wave method is used to analyze important parameters such as insertion loss, isolation, and reflection not only for the coplanar mode but also for conversion to the coupled slot line mode. The proposed method is used to analyze various coplanar structures printed on a GaAs substrate of finite height 410 mu m without lower ground metallization and shielding. Numerical results as a function of frequency and distance for approximately 50 Omega lines are obtained.<>
  • Keywords
    MMIC; S-matrix theory; losses; microstrip components; packaging; transmission line theory; 410 micron; CPW; GaAs substrate; MMIC; coplanar circuits; coplanar lines; coupled slot line mode; full-wave method; generalized scattering parameters; insertion loss; isolation; package densities; reflection; Apertures; Conductors; Coplanar waveguides; Coupling circuits; Electromagnetic fields; Impedance; Metallization; Microstrip; Packaging; Scattering parameters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 1993., IEEE MTT-S International
  • Conference_Location
    Atlanta, GA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-1209-0
  • Type

    conf

  • DOI
    10.1109/MWSYM.1993.277024
  • Filename
    277024