Inside a power module

Due to high current commutation speed, it has become necessary to minimize stray inductances to reduce over voltage. This is a great challenge for the power converter designer. Integration of converters into ever smaller packages decreases stray inductance considerably but at the same time increases other phenomena (thermal issues and EMC disturbances) capable of decreasing reliability and efficiency of the system. This work presents a generic equivalent cabling model and examines the impact of parasitic inductance on current distribution imbalance. This study could therefore be used in thermal analysis in order to better understand the influence of packaging.